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TGV (Glass Substrate for Semiconductors)


The Dream Material, Carving Semiconductors into Glass.

Advanced TGV Glass Substrate Solutions Powered by Ultra-Precision Processing

Glass substrates are semiconductor bases made from glass, replacing conventional plastic materials. Applying glass instead of plastic allows for:

· Thinner semiconductor packages
· Up to 50% reduction in power consumption
· Significant improvement in data processing capabilities

JNTC possesses advanced technologies essential for glass-based semiconductor packaging, including:

· Glass cutting for substrate processing
· Laser Through Glass Via (TGV) formation
· Electrode plating for glass packaging substrates

반도체 이미지
Property Description Glass Organic Silicon
Thermal resistance Thermal stabililty
Electrical Insulation Prevents
electrical signal interference
Flatness Mechanical stability (warpage)
Surface
Uniformity
Suitable for etching
and fine-pitch processing

Core Value

Laser



Rapid Through-Glass via processing with
high-precision positioning

Etching



Consistent via
formation with
smooth surface finish

Metalizing



Achieves uniform plating surface with superior
adhesion strength (500gf/mm↑)

CMP-free



CMP-free, Process with uniform thickness, Simplified
workflow and cost reduction


JNTC TGV Key Values

TGV key Values
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